News

Aerotech will be showcasing its high-precision multi-axis SMP (Surface MeasurementMotion Platform)
Control 2025 the international trade fair for industrial quality assurance 06 to 09 May 2025 Stuttgart Hall 3, Stand 3404 The ...

Manufacturers hit out at NIC and minimum wage increases as report reveals nearly half fear going out of business
Nearly half of manufacturers (49%) have concerns about their business surviving in the next five years thanks to the impact ...

Leuze Introduces New LiDAR Laser Scanners for Precision Contour Measurement
Leuze is expanding its product portfolio with LiDAR technology: New ROD 300 series of laser scanners for accurate contour measurement ...

Next Milestone Achieved for the Eplan Data Portal
Data isn’t just the driver for project planning and design. The Eplan Data Portal offers users access to high-quality product ...

Global geared products market contracted 3.7% in 2024
• Global revenues from geared products contracted by 3.7% in 2024• Decline driven by sluggish demand in APAC and over-stocking ...

CBM calls for balanced approach to UK Steel Policy amid US tariff concerns
The Confederation of British Metalforming (CBM) and its 200 members fully support the transition of British steelmakers to greener and ...

Rohde & Schwarz launches high-flexibility EMI test receivers at EMV2025 paving the way for optimized investments
The new EMI test receivers R&S EPL1001 up to 1 GHz and R&S EPL1007 up to 7.125 GHz offer engineers a flexible and cost-effective ...

FULLY INTEGRATED PROXIMITY PROBES SAVE TIME AND MONEY
Condition monitoring specialists SENSONICS continue to develop their extensive range of PROXIMITY SENSORS which includes their fully integrated PRI SERIES ...

Weald Electronics LMR Series Rack and Panel Connectors offer alternative to now obsolete ITW RED range
The LMR Series of rack and panel connectors from Weald Electronics provide a form, fit and function alternative to the ...

£9 million funding boost to bring key semiconductor manufacturing capability to Scotland
New development could cut chip packaging process from months to just days for UK firms A new R&D development designed ...